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SSD vane: BGA SSD size and package quite same as UFS, open the new opportunities of mobile market 18/03/16
SSD Form Factor has undergone a revolutionary evolution as 3D NAND expands its application and packaging technologies. SSD from the original 2.5-inch form factor to mSATA, M.2 (2280/2260), and then to highly integrated BGA package, its size can be done with embedded products eMMC / UFS equivalent to
Unigroup will mass-produce 32-layer 3D NAND in 2018 and begin to develop the next-generation 64-layer 3D NAND 18/03/14
China has a population of nearly 1.4 billion, a large consumer base and the largest market for mobile phones, its Huawei, OPPO and VIVO rank among the top five in the world.
How to tell the good from bad of SSD quality? 18/03/13
ChinaFlashMarket think there are three ways to do it.
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Top 10 semiconductor R&D spenders increase outlays 6% in 2017, says IC Insights
Qualcomm enters into amended definitive agreement with NXP
Qualcomm to Build Snapdragon 5G SoCs on Samsung 7nm LPP EUV Process
Intel to Bring 5G to Mobile PCs by 2019
Half a billion smartphones and other devices with wireless power technology shipped in 2017, IHS says
HTC smartphone business head resigns
Fujitsu Issues Recall for Battery Packs in Notebook Computers and Workstations
China smartphone vendors begin to step up component purchases
2018 Spring Festival Holiday Notice
Global spending on semiconductors increases markedly in 2017, says IHS
Qualcomm, USI to form JV in Brazil
Broadcom Makes Final $121 Billion Offer for Qualcomm
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Micron USD 60.58 +2.96
Intel USD 51.17 +0.57
WDC USD 106.45 +4.13
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ALCOR TWD 19.50 0.00
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A-DATA TWD 75.30 -0.53
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PTI TWD 94.00 -0.32
JCET CNY 21.40 +3.83
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