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SSD vane: BGA SSD size and package quite same as UFS, open the new opportunities of mobile market 18/03/16
SSD Form Factor has undergone a revolutionary evolution as 3D NAND expands its application and packaging technologies. SSD from the original 2.5-inch form factor to mSATA, M.2 (2280/2260), and then to highly integrated BGA package, its size can be done with embedded products eMMC / UFS equivalent to
Unigroup will mass-produce 32-layer 3D NAND in 2018 and begin to develop the next-generation 64-layer 3D NAND 18/03/14
China has a population of nearly 1.4 billion, a large consumer base and the largest market for mobile phones, its Huawei, OPPO and VIVO rank among the top five in the world.
How to tell the good from bad of SSD quality? 18/03/13
ChinaFlashMarket think there are three ways to do it.
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Samsung Galaxy 9 to be available on March 16
Lenovo Reveals the Yoga 730 and Yoga 530 2-in-1 Laptops with Alexa Support
Qualcomm Comes Around to Broadcom Acquisition, Wants the Price to be Right
MediaTek unveils Helio P60 chipset
China smartphone AP shipments to fall 18% in 1Q18
Nanya eyeing data center opportunities with 10nm DRAM
Huawei Unveils the MateBook X Pro and MediaPad M5 Series
Samsung looks to innovative S9 camera to energize Galaxy S smartphone sales, IHS says
Built for the Way We Communicate Today: Samsung Galaxy S9 and S9+
MediaTek reportedly shipping 12nm chips to Oppo, Vivo
Intel, Unigroup Spreadtrum & RDA team up for 5G smartphone chips in China
Top-5 notebook vendors see on-month shipment declines in January
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