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SSD vane: BGA SSD size and package quite same as UFS, open the new opportunities of mobile market 18/03/16
SSD Form Factor has undergone a revolutionary evolution as 3D NAND expands its application and packaging technologies. SSD from the original 2.5-inch form factor to mSATA, M.2 (2280/2260), and then to highly integrated BGA package, its size can be done with embedded products eMMC / UFS equivalent to
Unigroup will mass-produce 32-layer 3D NAND in 2018 and begin to develop the next-generation 64-layer 3D NAND 18/03/14
China has a population of nearly 1.4 billion, a large consumer base and the largest market for mobile phones, its Huawei, OPPO and VIVO rank among the top five in the world.
How to tell the good from bad of SSD quality? 18/03/13
ChinaFlashMarket think there are three ways to do it.
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Apple new entry-level MacBook to reach 4 million in unit shipments in 2018
Acer looking to expand presence in enterprise notebook market in Middle East, Africa
Intel Considers Buying Out Broadcom
Original vendors plus investment in new Fab factory and 3D NAND production competition, the market in 2018 may be over-supply
In 2018,256GB is expected to enter the high-end mobile phone market
Silicon wafer prices to rise over 30%, says Macronix chairman
2018 SSD is expected to become the largest NAND Flash applications market
Global wearable market grows 7.7% in 4Q17 and 10.3% in 2017, says IDC
Qualcomm is pushing back its pivotal shareholder meeting this week amid a regulatory review
Global chip sales increase 21.6% in 2017, says SIA
Southeast Asia smartphone shipments flat in 2017, says IDC
Samsung counting on micro LED to revive TV shipments in 2018
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