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SSD vane: BGA SSD size and package quite same as UFS, open the new opportunities of mobile market 18/03/16
SSD Form Factor has undergone a revolutionary evolution as 3D NAND expands its application and packaging technologies. SSD from the original 2.5-inch form factor to mSATA, M.2 (2280/2260), and then to highly integrated BGA package, its size can be done with embedded products eMMC / UFS equivalent to
Unigroup will mass-produce 32-layer 3D NAND in 2018 and begin to develop the next-generation 64-layer 3D NAND 18/03/14
China has a population of nearly 1.4 billion, a large consumer base and the largest market for mobile phones, its Huawei, OPPO and VIVO rank among the top five in the world.
How to tell the good from bad of SSD quality? 18/03/13
ChinaFlashMarket think there are three ways to do it.
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Apacer's Latest Z280 M.2 PCIe Gen 3 x4 SSD Hits Stores
Strong early iPhone X adoption positions Apple for market leadership, says IHS Markit
Personal computing device market to see -2% CAGR through 2021, says IDC
China and North America TV shipments fall sharply in 3Q17, says IHS Markit
Global notebook shipments to see -3.2% CAGR in 2018-2022
UMC Xiamen fab approved to gain US$600 million in capital
Tsinghua Unigroup secures financial support to facilitate memory chip plant
Taiwan market: Huawei launches Mate 10 series smartphones
China firm starts equipment move-in at DRAM fab, says report
Samsung to unseat Intel as top semiconductor supplier in 2017, says IC Insights
Global smartphone shipments to reach over 1.5 billion units in 2018
Worldwide tablet shipments to reach 128 million units in 2018
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