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SSD vane: BGA SSD size and package quite same as UFS, open the new opportunities of mobile market 18/03/16
SSD Form Factor has undergone a revolutionary evolution as 3D NAND expands its application and packaging technologies. SSD from the original 2.5-inch form factor to mSATA, M.2 (2280/2260), and then to highly integrated BGA package, its size can be done with embedded products eMMC / UFS equivalent to
Unigroup will mass-produce 32-layer 3D NAND in 2018 and begin to develop the next-generation 64-layer 3D NAND 18/03/14
China has a population of nearly 1.4 billion, a large consumer base and the largest market for mobile phones, its Huawei, OPPO and VIVO rank among the top five in the world.
How to tell the good from bad of SSD quality? 18/03/13
ChinaFlashMarket think there are three ways to do it.
To view news
Apple likely to buy up to 270 million smartphone panels in 2018
IC Insights raises 2018 chip market growth forecast
Pegatron upbeat about 1H18
ChipMOS optimistic about COF packaging, demand for NOR and niche-market DRAM
Hardware-based Protection Coming to Data Center and PC Products Later this Year: Intel CEO
Broadcom officially ends bid for Qualcomm
Foxconn top smartphone manufacturer in 4Q17, says IDC
Top-5 notebook vendors see slight shipment growth in February
Wistron expects better profits in 2018
Trump blocks Broadcom-Qualcomm deal, citing national security concerns
Samsung aims higher sales for Galaxy S9
Tight supply boosting profits for wafer suppliers
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Micron USD 60.58 +2.96
Intel USD 51.17 +0.57
WDC USD 106.45 +4.13
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Phison TWD 307.50 +1.15
SMI USD 46.78 +1.08
ALCOR TWD 19.50 0.00
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A-DATA TWD 75.30 -0.53
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OSE TWD 8.99 +0.22
PTI TWD 94.00 -0.32
JCET CNY 21.40 +3.83
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